Soft Termination Multilayer Ceramic Chip Capacitor | MLCC |CCAB - Specializing in capacitor production since 2005.

Soft Termination Multilayer Ceramic Chip Capacitor | MLCC |CCAB

INTRODUCTION
Jinpei Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid circuits and automatic surface mounting on any printed circuit boards.
CCAB series use a special material between nickel-barrier and ceramic body. It provides excellent performance to against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.

Datasheet-For-Soft-Termination-Multilayer-Ceramic-Chip-Capacitor-MLCC-CCAB.pdf (1031 downloads)

INTRODUCTION

Jinpei Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid circuits and automatic surface mounting on any printed circuit boards.
CCAB series use a special material between nickel-barrier and ceramic body. It provides excellent performance to against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.

FEATURES

a.High performance to withstanding 3~5mm of substrate bending test guarantee.
b.A wide selection of sizes is available.
c.High capacitance in given case size.
d.Capacitor with lead-free termination (pure Tin).
e.Reduction in PCB bend failure.
f.High reliability and stability.
g.RoHS & Jinpei compliant.

APPLICATIONS

a.For general digital circuit.
b.For power supply bypass capacitors.
c.For consumer electronics.
d.For telecommunication.
e.DC to DC converter.

PART NUMBER EXAMPLE

CCAB

1210

225

JINPEI

Series No.

Size

Dielectric

Capacitance

Tolerance

Rated

Voltage

Packaging

Thickness

Control

Code

Table 1

Table2

Table 3

Table 4

Table 5

Table 6

Table 7

Table 8

Table 9

Table 1	Series No.
Code	Description
FP	Anti-Bend General Purpose Product

Table 2		General Purpose
Code	Description		Code	Description	Code	Description
15	0402 (1005)		32	1210 (3225)	52	2211 (5728)
18	0603 (1608)		42	1808 (4520)	55	2220 (5750)
21	0805 (2012)		43	1812 (4532)	56	2225 (5763)
31	1206 (3216)		46	1825 (4563)

Table 3		Dielectric Material Characteristics
Code	Description		Code	Description
N	NPO		B	X7R
X	X5R		Y	Y5V

Table 4		Capacitance Rule Code
Code	Description		Code	Description
R47	0.47pF		102	102=10×102=1000pF
0R5	0.5pF		104	104=10×104=100nF
100	100=10×100=10pF		106	106=10×106=10µF

Table 5		Tolerance
Code	Description		Code	Description	Code	Description
A	±0.05 pF		I	-10% ~ 0%	Q	±0.03 pF
B	±0.10 pF		J	±5 %	Z	-20% ~ +80%
C	±0.25 pF		K	±10 %	X	+10% ~+20%
D	±0.50 pF		L	0% ~ +10%
F	±1 %		M	±20 %
G	±2 %		N	-5% ~ +10%
H	±3 %		P	±0.02 pF

Table 6		Rated Voltage
Code	Description		Code	Description	Code	Description
0J	6.3Vdc		2D	200Vdc	3R	1500Vdc
1A	10Vdc		2E	250Vdc	3D	2000Vdc
1C	16Vdc		2G	400Vdc	3U	3000Vdc
1E	25Vdc		2H	500Vdc	3G	4000Vdc
1H	50Vdc		2J	630Vdc	3H	5000Vdc
2A	100Vdc		3A	1000Vdc	3I	6000Vdc

Table 7		Packaging Type
Code	Description		Code	Description
B	Bulk		T	Tray package
E	Tape and 7” Reel, Embossed Tape		P	Tape and 7” Reel, Paper Tape
K	Tape and 10” Reel, Embossed Tape		D	Tape and 10” Reel, Paper Tape
L	Tape and 13” Reel, Embossed Tape		G	Tape and 13” Reel, Paper Tape

Table 8		Thickness Description
Code	Description		Code	Description	Code	Description
A	0.60 ± 0.10 mm		I	1.25 ± 0.20 mm	Q	0.50 +0.02/-0.05 mm
B	0.8 + 0.15/-0.10mm		J	1.15 ± 0.15 mm	R	3.10 ± 0.30 mm
C	1.25 ± 0.10 mm		K	0.50 ± 0.20 mm	S	0.80 ± 0.07 mm
D	1.40 ± 0.15 mm		L	0.30 ± 0.03 mm	T	0.85 ± 0.10 mm
E	1.60 ± 0.20 mm		M	0.95 ± 0.10 mm	U	0.50 ± 0.10 mm
F	2.00 ± 0.20 mm		N	0.50 ± 0.05 mm	V	0.20 ± 0.02 mm
G	2.50 ± 0.30 mm		O	3.50 ± 0.20 mm	X	0.80 ± 0.10 mm
H	2.80 ± 0.30 mm		P	1.60 +0.3/-0.10 mm	Z	0.25 ± 0.03 mm

Table 9		Special Control Code
Code	Description		Code	Description
G	RoHS Compliant		H	High reliability
O	Gold plating (Size≥0603)		Q	Surface Coating (Size 1206~2225)

Soft Termination Multilayer Ceramic Chip Capacitor | MLCC |CCAB

Soft Termination Multilayer Ceramic Chip Capacitor | MLCC |CCAB

INTRODUCTION

FEATURES

APPLICATIONS

PART NUMBER EXAMPLE

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