Cessatio mollis multilayer Ceramic Chip Capacitor | MLCC |CCAB - Consectetuer in capacitor productio quia 2005.

Cessatio mollis multilayer Ceramic Chip Capacitor | MLCC |CCAB

PRAEFATIO
Jinpei Multilayer Ceramic Chip Capacitors suppleverunt in mole vel tape & involucrum reel sunt specimen gyrorum hybridorum grossorum cinematographicorum et superficiei latae ascendentis in tabulas quaslibet circuitus typis impressas..
Series CCAB peculiari materia utuntur inter corpus nickel-obicum et ceramicum. Praebet observantiam optimam quae contra accentus in processu occurrit et plus securitatis pro processu PCB praebet.
In terminationibus nickel-obex concluditur nickel iacuit obice super argentum metallizationem et deinde confectum est per electroplatum stratum solidarium ut terminationes habeant bonam solidabilitatem.. Nickel obice iacuit in terminationibus impedit solutionem terminationis, cum extensa immersio in solida elevata solida temperatura conflata.

Datasheet-enim-mollis, Cessatio, multilayer, Ceramic-Chip, Capacitor, MLCC CCAB.pdf, (1309 downloads)

PRAEFATIO

Jinpei Multilayer Ceramic Chip Capacitors suppleverunt in mole vel tape & involucrum reel sunt specimen gyrorum hybridorum grossorum cinematographicorum et superficiei latae ascendentis in tabulas quaslibet circuitus typis impressas..
Series CCAB peculiari materia utuntur inter corpus nickel-obicum et ceramicum. Praebet observantiam optimam quae contra accentus in processu occurrit et plus securitatis pro processu PCB praebet.
In terminationibus nickel-obex concluditur nickel iacuit obice super argentum metallizationem et deinde confectum est per electroplatum stratum solidarium ut terminationes habeant bonam solidabilitatem.. Nickel obice iacuit in terminationibus impedit solutionem terminationis, cum extensa immersio in solida elevata solida temperatura conflata.

PARS

a.High perficientur ad resistendum III ~ 5mm subiectorum inflexio test cautione.
b.A lectio magnitudinum is available.
c.High capacitas in casu data magnitudine.
d.Capacitor cum plumbo libero terminationem (pura plumbi).
e.Reduction in PCB flectere defectum.
f.High reliability ac stabilitas.
g.RoHS & Jinpei obsequentem.

APPLICATIONS

a.For digital circuit.
b.For potentia copia bypass capacitors.
c.For dolor electronics.
d.For telecommunication.
e.DC ad DC converter.

PARS NUMBER EXEMPLUM

CCAB

1210

225

JINPEI

Series No.

Magnitudo

Dielectric

Capacitance

tolerantia

Ratum

voltage

Packaging

Crassitudo

Imperium

Code

Mensa 1

Table2

Mensa 3

Mensa 4

Mensa 5

Mensa 6

Mensa 7

Mensa 8

Mensa 9

Mensa 1	Series No.
Code	Description
FP	Anti-Band Generalis Propositum Product

Mensa 2		Commune
Code	Description		Code	Description	Code	Description
15	0402 (1005)		32	1210 (3225)	52	2211 (5728)
18	0603 (1608)		42	1808 (4520)	55	2220 (5750)
21	0805 (2012)		43	1812 (4532)	56	2225 (5763)
31	1206 (3216)		46	1825 (4563)

Mensa 3		Dielectrica Materia Characteres
Code	Description		Code	Description
N	NPO		B	X7r
X	X5R		ET	Y5V

Mensa 4		Facultas Regulae Code
Code	Description		Code	Description
R47	0.47pF		102	102= 10×102= 1000pF
0R5	0.5pF		104	104= 10×104= 100nF
100	100= 10×100= 10pF		106	106= 10×106= 10µF

Mensa 5		tolerantia
Code	Description		Code	Description	Code	Description
A	±0.05 pF		ego	-10% ~ 0%	Q	±0.03 pF
B	± 0.10 pF		J	±5 %	CUM	-20% ~ +80%
C	± 0.25 pF		K	±10 %	X	+10% ~+20%
D	±0.50 pF		I.	0% ~ +10%
F	±1 %		M	±20 %
G	±2 %		N	-5% ~ +10%
H	±3 %		P	±0.02 pF

Mensa 6		aestimavit intentione
Code	Description		Code	Description	Code	Description
0J	6.3VDC		2D	200VDC	3R	1500VDC
1A	10VDC		2E	250VDC	3D	2000VDC
1C	16VDC		2G	400VDC	3U	3000VDC
1E	25VDC		2H	500VDC	3G	4000VDC
1H	50VDC		2J	630VDC	3H	5000VDC
2A	100VDC		3A	1000VDC	3ego	6000VDC

Mensa 7		Packaging Type
Code	Description		Code	Description
B	Bulk		T	Tray sarcina
E	Tape et VII "Reel, Tape caelatum		P	Tape et VII "Reel, Charta Tape
K	Tape et X "Reel", Tape caelatum		D	Tape et X "Reel", Charta Tape
I.	Tape et XIII "Reel, Tape caelatum		G	Tape et XIII "Reel, Charta Tape

Mensa 8		Crassitudo Description
Code	Description		Code	Description	Code	Description
A	0.60 ± 0.10 mm		ego	1.25 ± 0.20 mm	Q	0.50 +0.02/-0.05 mm
B	0.8 + 0.15/-0.10mm		J	1.15 ± 0.15 mm	R	3.10 ± 0.30 mm
C	1.25 ± 0.10 mm		K	0.50 ± 0.20 mm	S	0.80 ± 0.07 mm
D	1.40 ± 0.15 mm		I.	0.30 ± 0.03 mm	T	0.85 ± 0.10 mm
E	1.60 ± 0.20 mm		M	0.95 ± 0.10 mm	U	0.50 ± 0.10 mm
F	2.00 ± 0.20 mm		N	0.50 ± 0.05 mm	V	0.20 ± 0.02 mm
G	2.50 ± 0.30 mm		O*	3.50 ± 0.20 mm	X	0.80 ± 0.10 mm
H	2.80 ± 0.30 mm		P	1.60 +0.3/-0.10 mm	CUM	0.25 ± 0.03 mm

Mensa 9		Special Control Code
Code	Description		Code	Description
G	RoHS Compliant		H	reliability excelsis
O*	Aurum plating (Size≥0603)		Q	Superficies Coating (Magnitudo 1206~2225)

Cessatio mollis multilayer Ceramic Chip Capacitor | MLCC |CCAB

Cessatio mollis multilayer Ceramic Chip Capacitor | MLCC |CCAB

PRAEFATIO

PARS

APPLICATIONS

PARS NUMBER EXEMPLUM

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