PROMIX Polymer Chip Tantalum Capacitors SMD ▏cBAC
Epoxy fingitur encapsulation, Chip, Securus ad integrationem, Polarized
Maxime humilis ESR , Volumetically efficientem , Stabilis in electrica & spectacula repono , Longa vita- span, Princeps reliability
-Typical applications includit DC / DC converters , ullamcorper PCs , portable electronics , telecommunicationum (mobile phone et basi statione ), ostendimus ,SSD,HDD et USB
Operative Standard: QJ/PWV517-2013.
Dimensiones – MILLIMETERS
| Causa Location | L | W1 | H | W2 | S | |
| A | 1206 | 3216 | 3.2± 0.2 | 1.6± 0.2 | 1.6± 0.2 | 0.8± 0.2 | 1.2± 0.2 |
| B | 1210 | 3225 | 3.5± 0.2 | 2.8± 0.2 | 1.9± 0.2 | 0.8± 0.2 | 2.2± 0.2 |
| C | 2312 | 6032 | 6.0± 0.2 | 3.2± 0.2 | 2.5± 0.2 | 1.3± 0.2 | 2.2± 0.2 |
| H | 2917 | 7343 | 7.3± 0.2 | 4.3± 0.2 | 2.0± 0.2 | 1.3± 0.2 | 2.4± 0.2 |
| D | 2917 | 7343 | 7.3± 0.2 | 4.3± 0.2 | 2.8± 0.2 | 1.3± 0.2 | 2.4± 0.2 |
| E | 2917 | 7343 | 7.3±0.4 | 4.3±0.4 | 4.1±0.4 | 1.3± 0.2 | 2.4± 0.2 |
| V | 2924 | 7361 | 7.3±0.4 | 6.1±0.4 | 3.6±0.4 | 1.35± 0.2 | 3.0± 0.2 |
| W | 2924 | 7361 | 7.3±0.4 | 6.1±0.4 | 4.1±0.4 | 1.35± 0.2 | 3.0± 0.2 |
Part Number Exemplum
Processus venditionis
capacitors Jinpei tantalum compatiuntur fluctus (una vel dual), convection, ET', aut vapor tempus reflow techniques. Preheating of these components is Commendatur ad vitandam extremam scelerisque vim.
Suntan commendatae condiciones profile pro convection et IR refluentes reflectunt conditiones profile de IPC/J CBAC vexillum sensitivum experimenti humoris. Maximum trium refluentium machinae his conditionibus tuto resistere possunt.
Manus solidatoria facienda cum cura ob difficultatem in processu potestate. Si fieri, cavendum est, ne contactu ferrum solidantis ad casum fictum. Ferrum pad utendum est ut calefacere ferrumen, applicando solida inter codex et terminationem, donec reflow occurs. Cum reflow occurs, ferrum tolli statim. "Wping" margines spumam et calefacit verticem superficiei non commendatur.
Per proprium reflow res, levi obscuratione auri- coloratus epoxy notari potest. Haec parva obscuratio normalis est nec damnosa producto. Vestigium permanentia non est affectus hac mutatione.
Nota: Specificationes obnoxiae sunt sine notitiam mutationi. Pro uberius ac update, placet visita nostrum website.
Features
epoxy effictus encapsulation, Chip, Securus ad integrationem, Polarized
valde humilis ESR , Volumetically efficientem , Stabilis in electrica & spectacula repono, Longa vita-spatio,Princeps reliability
Typicam applicationes includit DC / DC converters, ullamcorper PCs, portable electronics, telecommunicationum
(mobile phone et basi statione ), ostendimus,SSD,HDDand USB
Operativa Standard: QJ/PWV517-2013.
RoHS obsequentem
