Tantalum conductor Polymer Chip Capacitors SMD ▏CBAC

PARS
Epoxy fingitur encapsulation, chip, Facile integration, polarized
Maxime humilis ESR , Volumetrically agentibus , Firmum in electrica & spectacula repono , Vita longa- span, reliability excelsis
-Typical applications includit DC / DC converters , PCs ullamcorper , portable electronics , telecommunicationum (et basi statione telephono mobili ), iam ostendimus ,SSD,HDD et USB
Operative Standard: QJ / PWV517-2013.

Datasheet-enim-conductor, Polymer-Chip, Tantalum-Capacitors SMD▏CBAC.pdf, (1196 downloads)

DIMENSIONES – MILLIMETERS

	Causa Location	I.	W1	H	W2	S
A	1206 \| 3216	3.2±0.2	1.6±0.2	1.6±0.2	0.8±0.2	1.2±0.2
B	1210 \| 3225	3.5±0.2	2.8±0.2	1.9±0.2	0.8±0.2	2.2±0.2
C	2312 \| 6032	6.0±0.2	3.2±0.2	2.5±0.2	1.3±0.2	2.2±0.2
H	2917 \| 7343	7.3±0.2	4.3±0.2	2.0±0.2	1.3±0.2	2.4±0.2
D	2917 \| 7343	7.3±0.2	4.3±0.2	2.8±0.2	1.3±0.2	2.4±0.2
E	2917 \| 7343	7.3±0.4	4.3±0.4	4.1±0.4	1.3±0.2	2.4±0.2
V	2924 \| 7361	7.3±0.4	6.1±0.4	3.6±0.4	1.35±0.2	3.0±0.2
W	2924 \| 7361	7.3±0.4	6.1±0.4	4.1±0.4	1.35±0.2	3.0±0.2

PARS NUMBER EXEMPLUM

Processus venditionis

Jinpei tantalum capacitors componuntur cum fluctu (una vel dual), convection, IR, aut vapor tempus reflow techniques. Preheating of these components Commendatur ad vitandam extremam scelerisque accentus.
Commendatae suntan rationes profile pro convection et IR refluentes reflectunt conditiones profile de IPC/J CBAC vexillum sensitivum experimenti humoris. Cogitationes maximum trium refluentium his conditionibus tuto resistere possunt.

Manus solidaria facienda cum cura ob difficultatem in processu potestate. Si fieri, cavendum est, ne contactu ferrum ferrum solidantis ad casum effictum. Ferrum pad utendum est ut calefacere ferrumen, applicando solida inter codex et terminationem, donec reflow occurs. Cum reflow occurs, ferrum tollatur. "Wping" margines spumam et calefacit verticem superficiem non commendatur.

Per proprium reflow res, levi obscuratione auri- coloratus epoxy notari potest. Haec parva obscuratio normalis est nec damnosa producto. Vestigium permanentia non est affectus hac mutatione.

nota: Specificationes obnoxiae sunt sine notitia mutabilis. Pro uberius ac update, placet visita nostra website.

Features
Epoxy ⚫ fingi intellegebam encapsulation, chip, Facile integration, polarized
⚫ valde humilis ESR , Volumetrically agentibus , Firmum in electrica & spectacula repono, Longum vitae spatium,,reliability excelsis
Typicam ⚫ applications includit DC / DC converters, PCs ullamcorper, portable electronics, telecommunicationum
(et basi statione telephono mobili ), iam ostendimus,SSD,USB HDDand
Latin ⚫ operativa: QJ / PWV517-2013.
⚫ RoHS morigeratus

Tantalum conductor Polymer Chip Capacitors SMD ▏CBAC