软终端多层陶瓷芯片电容器 | MLCC |CCAB

介绍

Jinpei Multilayer Ceramic Chip Capacitors supplied in bulk or tape & 卷盘封装非常适合厚膜混合电路和任何印刷电路板上的自动表面安装.
CCAB系列在镍阻挡层和陶瓷体之间使用特殊材料. It provides excellent performance to against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.

特征

a.High performance to withstanding 3~5mm of substrate bending test guarantee.
b.A wide selection of sizes is available.
c.High capacitance in given case size.
d.Capacitor with lead-free termination (pure Tin).
e.Reduction in PCB bend failure.
f.High reliability and stability.
g.RoHS & Jinpei compliant.

APPLICATIONS

a.For general digital circuit.
b.For power supply bypass capacitors.
c.For consumer electronics.
d.For telecommunication.
e.DC to DC converter.

零件号示例

介绍
一个. High performance to withstanding 3~5mm of
substrate bending test guarantee.
b. A wide selection of sizes is available.
c. High capacitance in given case size.
d. Capacitor with lead-free termination (pure
Tin).
e. Reduction in PCB bend failure.
f. High reliability and stability.
g. RoHS & Jinpei compliant.