Instant Hot Faucet

The immediate hot faucet program is developed by NY8A050D single-chip microcomputer of Jiuqi. The package model is 8-pin SOP, which is developed and designed through the main control chip program. The product uses SCM to control the heater components to heat the water flow through the water pipe. Easy to use: turn on the faucet

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Ultrasonic Dental Cleaner

The ultrasonic tooth cleaner is developed by NY8A050D, which is packaged with 8-pin SOP. It is developed and designed by the main control chip program. The product uses single-chip microcomputer control ultrasonic pulse technology, using ac fixed speed motor to send ultrasonic to crush dental calculus. One key operation switch machine, one key to adjust

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Wireless Intelligent Moxibustion Box

Wireless intelligent moxibustion box program development by Jiuqi SINGLE chip NY8A062D model package model is 16 pin SOP, through the main control chip program development and design; The electronic product development and design is a very suitable for moisture removal of portable electronic equipment, through the single-chip control OF THE PTC heater catalysis artemisinia muggrass,…

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PCB Design Of Oximeter

The oximeter is used to detect blood oxygen. Monitoring blood oxygen is a non-invasive operation, which can effectively monitor the situation of blood oxygen in the body and play a key role in predicting the change of the disease. The main measurement indexes of oximeter are pulse rate, blood oxygen saturation and perfusion index (PI).…

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Infrared Touch Solution

Infrared touch PCBA solution, multi-touch, drive free, applied to touch all – in – one machine, teaching all – вуйсавырныш – one machine, advertising machine and so on. Full name of infrared touch frame: Infrared touch frame technology, touch the outer box installed in the integrated circuit, infrared emission and receiving of LED electronic component…

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Hybrid microelectronic

Hybrid microelectronic Jinpei is using existing conventional screen printing techniques to apply structures of less than 50 μm line|gap spacing to ceramic substrates.We can offer you the following benefits: ► Production of Hybrid circuits with extremely fine structures at low costs ► Avoiding local routing congestion ► Reducing the number of interconnected required layers Dust

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PCB Assemb | PCBA

Capability For PCB Assemb / PCBA ● Min. chip: 0201 (0603), 0402 (1005) ● Min. spacing: BGA 0.4mm Pitch, QFP/QFP 0.3mm Pitch ● Max. size: 533×610mm ● Support type: Manual welding, DIP plug-in, СМТ, Cable making, BGA ball, Rework, Connector crimping ● Support product: Communications, Industrial control, Chip testing, Automotive electronics, Medical equipment,да т. д.. ● Support

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