Trend 1. Artificial intelligence evolves from perceptual intelligence to cognitive intelligence
Artificial intelligence has reached or surpassed human level in the field of “hearing, speaking and seeing”, but it is still in its infancy in the field of cognitive intelligence, which requires external knowledge, logical reasoning or domain migration.Cognitive intelligence from cognitive psychology, brain sciences and inspiration in the history of human society, and combined with interdisciplinary knowledge map, causal reasoning, continuous learning, such as technology, establish the effective mechanism that stable knowledge acquisition and expression, make knowledge can be applied and machine understanding, key breakthrough to realize from the cognitive intelligence to cognitive intelligence.
Trend 2. The integration of computing and storage breaks through the bottleneck of AI computing force
The separation of storage and computation of the von neumann architecture is no longer suitable for data-driven artificial intelligence applications.The computational force bottleneck and power consumption bottleneck caused by the frequent data handling have become the limiting factor for the exploration of more advanced algorithms.Similar to the neural structure of the brain, the internal computing architecture integrates data storage unit and computing unit into one, which can significantly reduce data handling and greatly improve the parallelism and energy efficiency of computing.The innovation of computing and storage integration in hardware architecture will break through the bottleneck of AI computing force.
Trend 3. The superconvergence of industrial Internet
The rapid development of 5G, IoT devices, cloud computing and edge computing will promote the super-integration of industrial Internet and realize the intelligent integration of industrial control system, communication system and information system.Manufacturing enterprises will realize automation of equipment, transportation automation and production scheduling automation, so as to realize flexible manufacturing. Meanwhile, the upstream and downstream manufacturing lines of the factory can be adjusted and coordinated in real time.This will greatly improve the production efficiency of factories and the profitability of enterprises.For industries worth hundreds of billions or even millions of billions, increasing efficiency by 5-10% would generate trillions of renminbi.
Trend 4. Large-scale collaboration between machines becomes possible
Traditional single intelligence cannot satisfy the real-time perception and decision of large-scale intelligent devices.The development of collaborative sensing technology of Internet of things and 5G communication technology will realize the collaboration among multiple agents — machines cooperate with each other and compete with each other to complete the target tasks.The group intelligence brought by the cooperation of multiple intelligent bodies will further amplify the value of the intelligent system: large-scale intelligent traffic light dispatching will realize dynamic and real-time adjustment, warehouse robots will cooperate to complete efficient cooperation of cargo sorting, driverless cars can perceive the global road conditions, and group uav collaboration will efficiently get through the last kilometer of distribution.
Trend 5. Modularization lowers the threshold of chip design
Traditional chip design patterns cannot efficiently meet the needs of fast iteration, customization and fragmentation of chips.The open instruction set represented by risc-v and its corresponding open source SoC chip design, high-level abstract hardware description language and ip-based templating chip design method have promoted the rapid development of chip agile design method and open source chip ecology.In addition, the chiplet based modular design method encapsulates different functional “chip modules” together in advanced packaging, allowing rapid customization of a chip that meets the application requirements by skipping the flow chip, further speeding up the delivery of the chip.
Trend 6. Mass production level block chain application will enter the public
Blockchain as a Service will further lower the threshold for enterprises to apply Blockchain technology, and various hardware chips designed specifically for Blockchain such as end, cloud and chain curing core algorithms will also emerge as The Times require, so as to realize the anchoring of assets in the physical world and assets on the chain, further expand the boundary of value Internet and realize 10,000 chain interconnection.In the future, a large number of innovative blockchain application scenarios and multi-dimensional cooperation across industries and ecology will emerge, and more than 10 million production-level blockchain applications per day will be introduced to the public.
Trend 7. Quantum computing has entered a critical period
Вуйсавырныш 2019, the battle for “quantum hegemony” made quantum computing the focus of the world’s science and technology once again.The results of the superconducting quantum computing chip add to the industry’s optimistic expectations of the superconducting route and the pace of large-scale quantum computing.Вуйсавырныш 2020, the field of quantum computing will experience a stage of further increase in investment, intensified competition, accelerated industrialization and richer ecology.As two of the most critical technological milestones, fault-tolerant quantum computing and demonstration of practical quantum advantages will be the turning point of the practicality of quantum computing.Achieving any of these will be a daunting task in the next few years, and quantum computing will enter a technological phase.
New materials drive semiconductor device innovation
Under the dual pressure of Moore’s law slowdown and the explosion of computing power and storage demand, it is difficult for the classical transistor based on silicon to sustain the development of the semiconductor industry.The new materials will revolutionize the semiconductor industry through new physical mechanisms that enable new logic, storage, and interconnection concepts and devices.For example, topological insulators and two-dimensional superconducting materials can realize loss-free electron and spin transport, which can be the basis of new high-performance logic and interconnecting devices.New magnetic materials and new resistance materials can bring high performance magnetic memory such as sot-mram and resistance memory.
Trend 9: AI technology to protect data privacy will accelerate its arrival
Compliance costs associated with the flow of data are rising.The use of AI technology to protect data privacy is becoming a new technology hotspot, which can ensure the data security and privacy of all parties, and at the same time, unite users to achieve specific computing, solve the problem of data islands and low degree of data sharing trust, and realize the value of data.
10. Cloud becomes the center of IT technology innovation
With the further development of cloud technology, cloud has gone far beyond the scope of IT infrastructure and gradually evolved into the center of all IT technological innovation.Cloud has been through the new chip, the new database, since the driver adaptive network, Internet of things, big data, AI, chain blocks, quantum computing the IT technology link, at the same time derivative without server computing, cloud native software architecture, integration of hard and soft design, intelligent automation new technology such as operational mode, the cloud is to redefine IT.The cloud, in its broad sense, is constantly transforming new IT technologies into accessible services that form the infrastructure of the entire digital economy.
