Capability For PCB Assembly
● Min. chip: 0201 (0603), 0402 (1005)
● Min. spacing: BGA 0.4mm Pitch, QFP/QFP 0.3mm Pitch
● Max. size: 533×610mm
● Support type: Manual welding, DIP plug-in, SMT, Cable making, BGA ball, Rework, Connector crimping
● Support product: Communications, Industrial control, Chip testing, Automotive electronics, Medical equipment,etc.
● Support mode: Processing, Feed processing, Bonded processing, Processing of non-bonded
√ Japan imported equipment √ Two decades of experience √ Focus on prototyping √ Real-time progress tracking