Capability For PCB Assembly

● Min. chip: 0201 (0603), 0402 (1005)

● Min. spacing: BGA 0.4mm Pitch, QFP/QFP 0.3mm Pitch

● Max. size: 533×610mm

● Support type: Manual welding, DIP plug-in, SMT, Cable making, BGA ball, Rework, Connector crimping

● Support product: Communications, Industrial control, Chip testing, Automotive electronics, Medical equipment,etc.

● Support mode: Processing, Feed processing, Bonded processing, Processing of non-bonded

√ Japan imported equipment √ Two decades of experience √ Focus on prototyping √ Real-time progress tracking





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